Analysis of the Interfacial Reaction between Bulk Metallic Glass Coated Copper, Nickel, and Titanium with Lead-Free Solders

Authors

Andromeda Dwi Laksono, Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10672, TaiwanFollow
Yee-wen Yen, Material and Metallurgical Engineering, Institut Teknologi Kalimantan, Balikpapan, 76127, Indonesia
Rifqi Aulia Tanjung, Material and Metallurgical Engineering, Institut Teknologi Kalimantan, Balikpapan, 76127, Indonesia
Teodoro A. Amatosa, Engineering Graduate Program, School of Engineering, University of San Carlos, Cebu City 6000, Philippines
Ruki Harwahyu, Department of Electrical Engineering, Faculty of Engineering, Universitas Indonesia, Depok 16424, Indonesia

Abstract

Bulk metallic glass (BMG) has good mechanical strength, high hardness, wear resistance, and corrosion resistance with promising application in various industries. However, for the industrial production of BMG, the main issue is how to overcome limitations of joining with other materials. The present study focuses on solder processing at low operating temperature to avoid exceeding the recrystallization temperature. A feasible joining process for BMG was developed using lead-free solders. The BMG surface is pre-plated with copper, nickel, or titanium as a wetting layer. The reaction temperature is set between the glass transition temperature of BMG and the melting point of the solder. After a reflowing and aging process, the joint sample was examined using SEM, EDS, EPMA, and XRD. The Cu–Zr based BMG can be successfully joined with Sn-58Bi solder after plating Cu on the BMG surface. A diffusion layer was observed and the thickness increased with longer aging time. The main components of the diffusion layer are ZrO2 and Cu10Zr7.

Bahasa Abstract

Analisis Reaksi Antarmuka antara Tembaga, Nikel, dan Titanium Berlapis Bulk Metallic Glass dengan Solder Bebas Timbal. Bulk metallic glass (BMG) memiliki kekuatan mekanik yang baik, kekerasan tinggi, ketahanan aus, dan ketahanan korosi. BMG memiliki masa depan yang sangat menjanjikan di dunia industri. Namun, untuk penerapan BMG dalam produksi industri, masalah utama adalah bagaimana mengatasi sambungan dengan material lain. Penelitian ini berfokus pada pemrosesan solder, dengan suhu operasi rendah dengan tujuan untuk menghindari suhu rekristalisasi. Dengan menggunakan solder bebas timah, studi ini mengembangkan proses penggabungan dengan BMG. Permukaan BMG dilapisi Tembaga atau Nikel atau Titanium sebagai wetting layer. Temperatur reaksi diatur antara suhu transisi gelas BMG dan titik lebur solder. Setelah proses reflowing dan aging, sambungan yang terbentuk diuji SEM, EDS, EPMA, dan XRD. Ditemukan bahwa BMG berbasis Cu–Zr dapat bergabung dengan solder Sn-58Bi setelah dilapisi Cu pada permukaan BMG. Perkembangan lapisan difusi dan ketebalannya diamati meningkat dengan waktu penuaan yang lebih lama. Komponen utama dari lapisan difusi adalah ZrO2 dan Cu10Zr7.

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Recommended Citation

Laksono, Andromeda Dwi; Yen, Yee-wen; Tanjung, Rifqi Aulia; Amatosa, Teodoro A.; and Harwahyu, Ruki (2021) "Analysis of the Interfacial Reaction between Bulk Metallic Glass Coated Copper, Nickel, and Titanium with Lead-Free Solders," Makara Journal of Technology: Vol. 25: Iss. 1, Article 2.
DOI: 10.7454/mst.v25i1.3860
Available at: https://scholarhub.ui.ac.id/mjt/vol25/iss1/2